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Silicon Wafer

Product Numbers: JAH-Si Wafer

Place:

Product description:Silicon Wafer,Silicon Wafer factory,Grind Wafer, Single side polishing,Double side polishing,IC grade silicon wafer

INTRODUCTION

 Product Specification

 

Outline Size:

2"; 3"; 4"; 6"; 812"

Customize

Type:

N Type or P Type or Intrinsic

Customize

Diameter:

50-300mm

Thickness:

200 -1000 μm

Customize

Thickness Deviation:

±10μm

Total Indicated Runout(TIR):

< 3 μm

BOW

≤15μm

TTV:

≤10μm

Resistivity:

0.0001-10000 (Ω·cm)

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Carbon content:

≤5.0 × 1016 atoms/cc

Oxygen content:

≤1.0 ×1018 atoms/cc

Crystal Orientation:

100± 2;〈110± 2;〈111± 2

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Minority carrier lifetime:

≥15μs

Dislocation density

3X103 /cm2

Grade:

Optical or Solar or IC

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Surface Treatment:

Lapping, Single Side Polishing, Double Side Polishing

Customize

 

Please indicate the information as below if you want to buy this product

1、Resistivity;

2、Size;

3、Thickness

4、Single Side Polishing or Double Side Polishing or Grind

5、Grade

6、Conduction type: P Type or Ntype or Intrinsic

7、Doping type:Doping B,Doping P,Doping As,Doping Ga,Doping Sb,or Doping None

8、Quantity

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