|
|
|
PRODUCTS LIST
Home > Product Show
|
SOI Wafer
Product Numbers: JAH-SOI
Place:
Product description:
|
|
|
INTRODUCTION
Product Specification
|
Outline Size
|
4"、6"、8"
|
|
Process
|
Smart cut; Bonding; SIMOX
|
|
Conductive Type
|
N/P
|
|
Resistivity
|
Customize
|
|
The Thickness of the Top Crystal
|
0.20～100µm
|
|
BOX
|
0.4～4µm
|
|
The Basal layer thicknes
|
100～500µm
|
|
TTV
|
< 3µm
|
|
Paritlce
|
<10@0.3µm
|
|
Si Wafer/SOI Wafer/SiO2 Wafer
