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GaSb Wafer

Product Numbers: JAH-GaAs Wafer

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Product description:

INTRODUCTION

 Product Specification

Crystal Material

Single Crystal Gallium Arsenide, VGF / LECgrown, 高纯单晶

Crystal Orientation

(1 0 0) / (1 1 1)

Doping

Undoped

Zn

Si / Te

Diameter

50~150mm ± 0.25mm2" 3" 4"6"

Thickness

350 ± 25um / 550 ± 25um / 625 ± 25um

Crystal Orientation Angle

100 )or(111) α 0 ±β 0, off angle α and accuracy β upon request

Resistivity

(1-30)x10 7 Ω.cm

(1-10)x10 -3 Ω.cm

Mobility Ratio

1500~3000 3000~5000 cm2 / V·sec

N / A

doping content

N / A

(0.1-3.0)×10 18 /cm3

Etch Pit Density

≤ 5·103 cm-2

≤ 7·10 4cm-2

≤ 5·102 cm-2

Primary flat length

(0-1-1)±0.5deg, 16 ±1.0mm /22±1.0mm/32.5±1.0mm

Second flat length

(0-1 1) )±5.0 deg, 8 ±1.0mm / 11±1.0mm/ 18±1.0mm

Front surface

Polished in Epi-ready Prime grade, 外延生长级抛光

Back Surface

Polished / Lapping or Etched, 抛光 / 研磨或腐蚀

Epi-ready

Yes

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